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Epoxy Parfilm mold release is recommended for epoxy resins. Its highly effective, micro-thin, film-forming application offers a better release than polyvinyl alcohol or wax. Its micro-thin film maintains the fidelity of the cast piece and affords better surface reproduction and finish. Heat stable to 635F. New generation of solvent free, premium mold releases No time lost waiting for solvent to evaporate for faster molding cycles Net weight of a full 12 ounces per can. All active ingredients are heavy duty, low-odor and field proven to be the most effective for their specific plastics. Available in silicone and paintable universal releases as well as plastic-specifics for the right release in any application. Level I Aerosol for easy, convenient and on-site storage. NON-CFC NON-HCFC Non-flammable by ASTM D3065-01 Aerosol Standard Test Method.